TR7007 SII Plus

3D Solder Paste Inspection (SPI)

Introduction

With industry leading speeds of up to 200 cm2/sec, the TR7007 SII Plus is the perfect SPI solution for any production line. This highly accurate inline shadow-free solder paste inspection solution offers full 3D inspection at resolutions of 15 µm or 10 µm. Built on a high precision, reliable linear motor platform, the system’s hallmark features include closed loop function, enhanced 2D imaging, auto-warp compensation and fringe pattern technology. TRI’s quick and intuitive user interface makes programming simple and easy, bringing maximum value to your production.

Featured

  • Industry leading inspection speed up to 200 cm2/sec @ 15 µm
  • Shadow free Fringe Pattern lighting technology
  • Optical resolution 10 µm or 15 µm
  • Linear motor design for stable and accurate inspection
  • Advanced SPC functions for production quality monitoring and evaluation
TRI TR7007 SII Plus 3D Solder Paste Inspection

Optical System

 
Imaging MethodDynamic Imaging
Camera4 Mpix
Imaging Resolution10 µm or 15 µm (factory setting)
LightingRGB LED
3D Technology2-way Digital Fringe Pattern
Field of View4 Mpix@ 10 µm: 20 x 20 mm
4 Mpix@ 15 µm: 30 x 30 mm

Inspection Performance

Imaging Speed4 Mpix@ 10 µm: 90 cm²/sec
4 Mpix@ 15 µm: 200 cm²/sec
Height Resolution0.4 µm
Max. Solder Height@ 10 µm: 420 µm
@ 15 µm: 385 µm
Motion Table & Control
X-Axis ControlLinear Motor and linear scale with DSP-based controller
Y-Axis ControlBallscrew + AC-servo controller
Z-Axis ControlBallscrew + AC-servo controller
X-Y Axis Resolution0.5 µm with linear scale
Z-Axis Resolution1 µm

Board Handling

Max PCB SizeTR7007 SII Plus: 510 x 460 mm
TR7007L SII Plus: 660 x 610 mm
TR7007 SII Plus DL: 510 x 310 mm x 2 lanes, 510 x 590 mm x 1 lane
PCB Thickness0.6-5 mm
Max PCB Weight3 kg
Top Clearance25 mm
Bottom Clearance40 mm
Edge Clearance3 mm
Conveyor Height880 – 920 mm
* SMEMA Compatible

Inspection Functions

DefectsInsufficient Paste
Excessive Paste
Shape Deformity
Missing Paste & Bridging
MeasurementHeight
Area
Volume
Offset

Dimensions

WxDxHTR7007 SII Plus: 1100 x 1570 x 1550
TR7007L SII Plus: 1300 x 1610 x 1560 mm
TR7007 SII Plus DL: 1100 x 1770 x 1560 mm

Note: not including signal tower, signal tower height 520 mm
WeightTR7007 SII Plus: 950 kg
TR7007L SII Plus: 1250 kg
TR7007 SII Plus DL: 1100 kg

Contact our specialist to learn more

To learn more about the TRI TR7007 SII Plus 3D Solder Paste Inspection System, speak our our sales and technical team they are on hand to support any questions you may have.