TR7007DI

3D Solder Paste Inspection (SPI)

Introduction

Built upon latest 3D projection technology, the TR7007DI SPI offers industry leading inspection accuracy for the most demanding applications. The inline inspection system automatically optimizes the inspection route for best performance, and TRI’s innovative SmartWarp system compensates for any board warpage during inspection. The TR7007DI is a versatile SPI solution bringing accuracy and speed to your fingertips.

Featured

  • 100% Shadow-free Dual Digital Fringe projectors
  • Optimized Stop-and-Go Design for Maximum Accuracy
  • SmartWarp Compensation Eliminates Local PCB Deformation
  • 100% Solder Paste Defect Coverage including Low Bridges
TRI TR7007DI 3D Solder Paste Inspection

Optical System

 
Imaging MethodStop-and-Go Imaging
Camera4 Mpix or 12 Mpix (factory setting)
Imaging Resolution6 μm, 10 μm , 15 µm (factory setting)
LightingRGB True Color LED
3D Technology2-way Digital Fringe Pattern
Field of View4 Mpix@ 10 µm: 20.3 x 20.3 mm
4 Mpix@ 15 µm: 30.5 x 30.5 mm
12 Mpix@ 6 µm: 24.4 x 18.4 mm*
12 Mpix@ 10 µm: 40.8 x 30.7 mm
12 Mpix@ 15 µm: 61.2 x 46.1 mm

* 6 μm is not available for TR7007DI DL

Inspection Performance

Imaging Speed4 Mpix: 3 FOV/sec
12 Mpix: 2 FOV/sec
12 Mpix CoaXPress: 3 FOV/sec*

Note: Inspection speed depends on PCB and inspection conditions
* With optional CoaXPress upgrade
Height Resolution@ 6 µm: 0.22 µm
@ 10/15 µm: 0.4 µm
Max. Solder Height@ 6 µm: 210/420 µm
@ 10/15 µm: 420/840 µm
Motion Table & Control
X-Axis ControlBallscrew + AC-servo controller
Y-Axis ControlBallscrew + AC-servo controller
Z-Axis ControlBallscrew + AC-servo controller
X-Y Axis Resolution1 μm (up to 0.5 μm with optional linear encoder)
Z-Axis Resolution1 μm (up to 0.5 μm with optional linear encoder)

Board Handling

Max PCB SizeTR70007DI: 510 x 460 mm*
TR7007DI DL: 510 x 310 mm x 2 lanes, 510 x 590 mm x 1 lane

* 6 μm is only available for TR7007DI, the Max. PCB size is 330 x 310 mm
PCB Thickness0.6-5 mm
Max PCB Weight3 kg
Top Clearance25 mm
Bottom Clearance40 mm
Edge Clearance3 mm
Conveyor Height880 – 920 mm
* SMEMA Compatible

Inspection Functions

DefectsInsufficient Paste
Excessive Paste
Shape Deformity
Missing Paste & Bridging
MeasurementHeight
Area
Volume
Offset

Dimensions

WxDxHTR7007DI: 1000 x 1500 x 1650 mm
TR7007DI DL: 1000 x 1700 x 1650 mm

Note: not including signal tower, signal tower height 520 mm
WeightTR7007DI: 675 kg
TR7007DI DL: 685 kg

Contact our specialist to learn more

To learn more about the TRI TR7007DI 3D Solder Paste Inspection System, speak our our sales and technical team they are on hand to support any questions you may have.