Introduction
TRI’s optimum 3D AOI solution delivers the fastest multi-angle PCB inspection coupled with blue-laser-based true 3D profile measurement for the highest automated optical defect symptoms coverage possible. Combining state-of-the-art software solution and third generation intelligent hardware platform, the TR7500 SIII 3D offers robust 3D solder and component defect inspection and with high inspection coverage and easy programming.
Featured
High Speed Color Multi-angle Inspection of Up to 01005 Components
High Defect Coverage Using Hybrid 2D+3D Inspection Technology
True 3D Profile Measurement Using Dual Laser Units
Rapid Programming Interface with Auto Library and Offline Editing
Optical System | |
|---|---|
| Imaging Method | Dynamic Imaging with true 3D profile measurement |
| Top Camera | 4 Mpix |
| Angle Camera | 1.3 Mpix or 6.5 Mpix (factory setting) |
| Imaging Resolution | Optical: 10 µm, 15 µm Laser: 10 μm (optional), 20 μm, 50 μm Note: Factory setting |
| Lighting | Multi-phase RGB+W LED |
| 3D Technology | Single/Dual 3D laser sensors |
| Max. 3D Range | 20 mm |
Inspection Performance | |
| Imaging Speed | 4 Mpix@ 10 µm 2D: 60 cm²/sec 4 Mpix@ 15 µm 2D: 120 cm²/sec 4 Mpix@ 10 µm 2D+3D: 27-39 cm²/sec* 4 Mpix@ 15 µm 2D+3D: 40-60 cm²/sec* * Depending on board size and laser resolution |
| Motion Table & Control | |
| X-Axis Control | Ballscrew + AC-servo controller |
| Y-Axis Control | Ballscrew + AC-servo controller |
| Z-Axis Control | N/A |
| X-Y Axis Resolution | 1 µm |
Board Handling | |
| Max PCB Size | TR7500 SIII 3D: 510 x 460 mm* TR7500L SIII 3D: 660 x 460 mm TR7500 SIII 3D DL: 510 x 250 mm x 2 lanes, 510 x 550 mm x 1 lane * The testable PCB size range will vary depending on the configuration of laser probe *Depending on component distribution, the vailable PCB size could be different |
| PCB Thickness | 0.6-5 mm |
| Max PCB Weight | 3 kg |
| Top Clearance | 15 mm/25 mm/48 mm [optional] Note: (1) Laser resolution@ 50 μm is 25 or 48 mm (optional) (2) Laser resolution@ 20 μm is 25 mm (3) Laser resolution@ 10 μm is 15 mm |
| Bottom Clearance | 40 mm |
| Edge Clearance | 3 mm |
| Conveyor Height | Inline Height: 880 – 920 mm * SMEMA Compatible |
Inspection Functions | |
| Component | Missing Tombstoning Billboarding Polarity Rotation Shift Wrong Marking (OCV) Defective Upside Down Extra Component Foreign Material Lifted Component |
| Solder | Excess Solder Insufficient Solder Bridging Through-hole Pins Lifted Lead Golden Finger Scratch/Contamination |
Dimensions | |
| WxDxH | TR7500 SIII 3D: 1100 x 1670 x 1550 mm TR7500L SIII 3D: 1300 x 1630 x 1655 mm TR7500 SIII 3D DL: 1100 x 1770 x 1550 mm Note: not including signal tower, signal tower height 520 mm |
| Weight | TR7500 SIII 3D: 1010 kg TR7500L SIII 3D: 1250 kg TR7500 SIII 3D DL: 1150 kg |
Contact our specialist to learn more
To learn more about the TRI TR7500 SIII Automated Optical Inspection System, speak our our sales and technical team they are on hand to support any questions you may have.