TR7700QE

Automated Optical Inspection (AOI)

Introduction

The TR7700QE AOI offers high performance 3D solder and assembly inspection by combining the next generation 2D and 3D technologies based on 4-way adaptive digital fringe pattern projection. Latest inspection software ensures quick CAD-based programming and features fully customizable templates for zero escapes on any PCBAs.

Featured
Advanced 2D + 3D Coverage
4-way Digital Fringe Projectors
Up to 40 mm 3D Height Range
High Speed CoaXPress Imaging
Optional 3D Laser Module

TR7700QE Automated Optical Inspection

Optical System

 
Imaging MethodStop-and-Go Imaging
Top Camera12 Mpix
Angle CameraN/A
Imaging Resolution10 µm, 15 µm (factory setting)
LightingMulti-phase true color LED, Coaxial lighting
3D TechnologyQuad Digital Fringe Projectors
Max. 3D Range12 Mpix@ 10 µm: 0-10 mm
12 Mpix@ 15 µm: 0-40 mm*

* Requires GPU card upgrade. The default 3D height is 0 – 20mm

Inspection Performance

Imaging Speed12 Mpix@ 10 µm: 13.5 cm²/sec
12 Mpix@ 10 µm: 23 cm²/sec with optional CoaXPress
12 Mpix@ 15 µm: 30 cm²/sec
12 Mpix@ 15 µm: 50 cm²/sec with optional CoaXPress

Note: Depending on component distribution
Motion Table & Control
X-Axis ControlBallscrew + AC-servo controller (Linear motor optional)
Y-Axis ControlDual driven ballscrew + AC-servo controller
Z-Axis ControlBallscrew + AC-servo controller
X-Y Axis Resolution1 µm

Board Handling

Max PCB SizeTR7700QE: 510 x 460 mm
TR7700L QE: 660 x 610 mm
TR7700QE DL: 510 x 310 mm x 2 lanes, 510 x 590 mm x 1 lane
PCB Thickness0.6-5 mm
Max PCB Weight3 kg
Top Clearance50 mm
Bottom Clearance40 mm
Edge Clearance3 mm [5 mm optional]
Conveyor HeightInline
Height: 880 – 920 mm

* SMEMA Compatible

Inspection Functions

ComponentMissing
Tombstoning
Billboarding
Polarity
Rotation
Shift
Wrong Marking (OCV)
Defective
Upside Down
Extra Component
Foreign Material
Lifted Component
Solder Solder Fillet Height
Solder Volume %
Excess Solder
Insufficient Solder
Bridging
Through-hole Pins
Lifted Lead
Golden Finger
Scratch/Contamination

Dimensions

WxDxHTR7700QE: 1100 x 1730 x 1750 mm
TR7700L QE: 1250 x 1880 x 1750 mm
TR7700QE DL: 1100 x 1830 x 1750 mm

Note: not including signal tower, signal tower height 520 mm
WeightTR7700QE: 920 kg
TR7700L QE: 1170 kg
TR7700QE DL: 950 kg

Contact our specialist to learn more

To learn more about the TRI TR7007 SII 3D Solder Paste Inspection System, speak our our sales and technical team they are on hand to support any questions you may have.