High Speed
High Speed
SF160FCT is a high-resolution micro-focus X-ray system for the inspection of semiconductor, PCB assembly, and electronic component. With its superior X-ray imaging, micro-scale hidden defects can be detected in high resolution.
SF160FCT equips 160kV micro-focus open tube with 0.8um spot size. The system can magnify the object up to 4,800x and display the X-ray image at any angle using 6-axis manipulator configuration.
BGA, CSP – Open, Crack, Cold Soldering
General Solder Joint – Bridging, Void
Auto Voiding Area Calculation
Wire Bonding – Broken Wire, Lifted Wire, Sweeping
Bump, Pattern De-lamination, Void, Crack
3D Packaging – MCP, TSV, FCB micro defect
Multilayer Pattern Open, Short Inspection and Analysis
Via-Hole Alignment, Copper Wall Plate
FPCB (Flexible PCB) – Blind Via Hole (Laser Via)
Connector – Internal Wire Connection
Camera Modul Component Attachment
General Pattern Open Short, Hidden Contamination
X-ray Tube | 160 kV / 200 µA (option 160 kV / 500 µA) |
Min. Resolution | 0.9 µm |
Table Size | 460 X 510 mm (option 550 X 650 mm) |
AXIS | X, Y, Z, Tilt (70º), R, Y-aft, Cone beam R |
Detector | 5 inch Pixel FPD |
CT Scan Method | Oblique CT / Cone beam CT |
Foot print | 1,340mm x 1,460mm x 1,670mm |
Weight | 2,000kg |
Contact our dedicated team at SMT Inspection today, where we will support you whether you are looking to book a demo, purchase a system, or require further information.